Rewa Technology YouTube channel has published the first detailed dismantling of iPhone 17 Pro, which reveals several features of the device's internal architecture, as reported by 9TO5MAC.
The new model has an increased number of screws (14) and less sticky connections, which can be easier to repair. The design also includes a large graphic sheet for a better heat dysprotia.
Special attention was paid to the cameras. The back and front modules have larger sensors. Apple has also rearranged the point projector and Face ID IR radier.
The logical board has become more denser and is now horizontally positioned, a solution that, according to experts, can improve the resistance of the device. However, the Nand Memory Chip and the Apple A19 processor are located on opposite sides of the board, overlooking each other, complicating the possible maintenance of the memory chip and increasing the risk of overheating.
Experts noted that the iPhone 17 Pro is more renovated than previous generations, but the new connectors of certain components increase the probability of dismantling.
Translation of: Euromedia24.com
